The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 31, 2017
Filed:
Dec. 31, 2014
Applicant:
Tai-saw Technology Co., Ltd., Taoyuan, TW;
Inventors:
Yu-Tung Huang, Taoyuan, TW;
Ming-Hung Chang, Taoyuan, TW;
Assignee:
TAI-SAW TECHNOLOGY CO., LTD., Taoyuan, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/02 (2006.01); H05K 3/30 (2006.01); H01L 23/498 (2006.01); H05K 1/11 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H05K 3/305 (2013.01); H01L 23/49811 (2013.01); H01L 24/13 (2013.01); H01L 24/81 (2013.01); H01L 2224/1319 (2013.01); H01L 2224/16237 (2013.01); H01L 2224/81192 (2013.01); H01L 2224/81385 (2013.01); H01L 2224/81439 (2013.01); H01L 2224/81444 (2013.01); H01L 2224/81447 (2013.01); H05K 1/111 (2013.01); H05K 2201/0373 (2013.01); H05K 2201/09781 (2013.01); Y02P 70/613 (2015.11); Y10T 156/10 (2015.01);
Abstract
A conducting package structure includes a substrate and a conducting material. The conducting material is formed to a first patterned structure. The first patterned structure has a first surface which is connected to the substrate and a patterned second surface opposite to the first surface.