The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 31, 2017

Filed:

Jan. 26, 2016
Applicants:

HU Chen, Shenzhen, CN;

Kai Wang, Shenzhen, CN;

Inventors:

Hu Chen, Shenzhen, CN;

Kai Wang, Shenzhen, CN;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H04R 19/04 (2006.01); B81B 7/02 (2006.01); H04R 19/00 (2006.01);
U.S. Cl.
CPC ...
H04R 19/04 (2013.01); B81B 7/02 (2013.01); B81B 2201/0257 (2013.01); B81B 2203/0315 (2013.01); B81B 2207/015 (2013.01); B81B 2207/07 (2013.01); H04R 19/005 (2013.01); H04R 2201/003 (2013.01);
Abstract

The MEMS microphone includes a first circuit board; a second circuit board keeping a distance from the first circuit board; a frame located between the first circuit board and the second circuit board for forming a cavity cooperatively with the first circuit board and the second circuit board, the frame including a plated-through-hole; an ASIC chip located in the cavity; and an MEMS chip having a back cavity. The first circuit board is electrically connected with the second circuit board by the plated-through-hole. The frame includes a conductive layer and an insulating layer, and the conductive layer is located between an inner surface of the frame and the insulating layer.


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