The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 31, 2017

Filed:

Jan. 30, 2015
Applicant:

Lumens Co., Ltd., Yongin-si, Gyeonggi-do, KR;

Inventors:

Seung-Hyun Oh, Gwangju-si, KR;

Seung-Hoon Lee, Yongin-si, KR;

Kang-Min Han, Suwon-si, KR;

Assignee:

LUMENS CO., LTD., Yongin-si, KR;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 33/00 (2010.01); H01L 33/62 (2010.01); H01L 33/48 (2010.01); H01L 33/58 (2010.01); H01L 33/60 (2010.01);
U.S. Cl.
CPC ...
H01L 33/62 (2013.01); H01L 33/486 (2013.01); H01L 33/58 (2013.01); H01L 33/60 (2013.01); H01L 2224/16245 (2013.01); H01L 2933/0066 (2013.01);
Abstract

Disclosed herein are a light emitting device package, a backlight unit, and a method of manufacturing a light emitting device package capable of being used for a display application or an illumination application. The light emitting device package includes: a flip-chip type light emitting device having a first pad and a second pad; a lead frame having a first electrode installed at one side of an electrode separation space and a second electrode installed at the other side thereof, and having the light emitting device seated thereon; a first bonding medium installed between the first pad and the first electrode so that the first pad of the light emitting device and the first electrode of the lead frame are electrically connected to each other; and a second bonding medium installed between the second pad and the second electrode so that the second pad of the light emitting device and the second electrode of the lead frame are electrically connected to each other, wherein at least one first accommodating cup part accommodating the first bonding medium therein is formed in the first electrode of the lead frame, and at least one second accommodating cup part accommodating the second bonding medium therein is formed in the second electrode of the lead frame.


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