The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 31, 2017

Filed:

Dec. 04, 2014
Applicant:

Sharp Kabushiki Kaisha, Osaka-shi, Osaka, JP;

Inventors:

Masahiro Konishi, Osaka, JP;

Shin Itoh, Osaka, JP;

Hiroyuki Nokubo, Osaka, JP;

Yoshiaki Itakura, Osaka, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 33/00 (2010.01); H01L 33/62 (2010.01); H01L 33/60 (2010.01); H01L 33/64 (2010.01); H05K 1/02 (2006.01); H05K 1/05 (2006.01); H01L 21/48 (2006.01); H01L 33/54 (2010.01); H01L 25/075 (2006.01); H05K 3/28 (2006.01);
U.S. Cl.
CPC ...
H01L 33/62 (2013.01); H01L 21/4846 (2013.01); H01L 33/54 (2013.01); H01L 33/60 (2013.01); H01L 33/641 (2013.01); H05K 1/0274 (2013.01); H05K 1/053 (2013.01); H01L 25/0753 (2013.01); H01L 2224/16225 (2013.01); H05K 3/285 (2013.01); H05K 2201/10106 (2013.01); H05K 2201/2054 (2013.01);
Abstract

Provided is a substrate for a light emitting device having high reflectivity, high heat radiating properties, dielectric strength voltage properties, long-term reliability including heat resistance and light resistance, and excellent mass productivity. A substrate () for a light emitting device includes: a first insulating layer () having thermal conductivity which is formed on a surface of one side of a metal base (); a wiring pattern () which is formed on the first insulating layer (); and a second insulating layer () having light reflectivity which is formed on the first insulating layer () and on some parts of the wiring pattern (), so that some parts of the wiring pattern () are exposed, in which the first insulating layer () is a layer of ceramic formed by thermal spraying.


Find Patent Forward Citations

Loading…