The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 31, 2017
Filed:
Jan. 30, 2015
Applicant:
Nichia Corporation, Anan-shi, Tokushima, JP;
Inventors:
Assignee:
Nichia Corporation, Anan-shi, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/56 (2010.01); H01L 33/46 (2010.01); H01L 33/60 (2010.01); H01L 33/62 (2010.01); H01L 33/48 (2010.01); H01L 25/075 (2006.01); H01L 25/16 (2006.01);
U.S. Cl.
CPC ...
H01L 33/46 (2013.01); H01L 33/486 (2013.01); H01L 33/56 (2013.01); H01L 33/60 (2013.01); H01L 33/62 (2013.01); H01L 25/0753 (2013.01); H01L 25/167 (2013.01); H01L 2224/45144 (2013.01); H01L 2224/48137 (2013.01); H01L 2224/48465 (2013.01); H01L 2224/4945 (2013.01); H01L 2924/01322 (2013.01); H01L 2933/005 (2013.01); H01L 2933/0025 (2013.01); H01L 2933/0033 (2013.01); H01L 2933/0066 (2013.01);
Abstract
A method of manufacturing a light emitting device includes a first step of mounting a light emitting element on a substrate having a conductor wiring and electrically connecting the light emitting element with the conductor wiring, a second step of disposing a light reflecting resin which reflects light from the light emitting element to surround the light emitting element, and a third step of disposing a sealing member after hardening the light reflecting resin to cover the light emitting element.