The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 31, 2017

Filed:

Nov. 12, 2014
Applicant:

Solexel, Inc., Milpitas, CA (US);

Inventors:

Mehrdad M. Moslehi, Los Altos, CA (US);

Thom Stalcup, Boulder, CO (US);

Karl-Josef Kramer, San Jose, CA (US);

Anthony Calcaterra, Milpitas, CA (US);

Virendra V. Rana, Los Altos, CA (US);

Sean M. Seutter, San Jose, CA (US);

Pawan Kapur, Burlingame, CA (US);

Michael Wingert, Los Gatos, CA (US);

Assignee:

OB REALTY, LLC, Irvine, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 31/18 (2006.01); H01L 31/0224 (2006.01); H01L 31/068 (2012.01);
U.S. Cl.
CPC ...
H01L 31/1804 (2013.01); H01L 31/022441 (2013.01); H01L 31/0682 (2013.01); Y02E 10/547 (2013.01); Y02P 70/521 (2015.11);
Abstract

A back contact solar cell is described which includes a semiconductor light absorbing layer; a first-level metal layer (M1), the M1 metal layer on a back side of the light absorbing layer, the back side being opposite from a front side of the light absorbing layer designed to receive incident light; an electrically insulating backplane sheet backside of said solar cell with the M1 layer, the backplane sheet comprising a plurality of via holes that expose portions of the M1 layer beneath the backplane sheet; and an M2 layer in contact with the backplane sheet, the M2 layer made of a sheet of pre-fabricated metal foil material comprising a thickness of between 5-250 μm, the M2 layer electrically connected to the M1 layer through the via holes in the backplane sheet.


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