The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 31, 2017
Filed:
Sep. 17, 2015
Applicant:
Boe Technology Group Co., Ltd, Beijing, CN;
Inventor:
Xiaolin Wang, Beijing, CN;
Assignee:
BOE TECHNOLOGY GROUP CO., LTD., Beijing, CN;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/14 (2006.01); H01L 27/12 (2006.01); G02F 1/1362 (2006.01); G02F 1/1368 (2006.01); H01L 27/02 (2006.01);
U.S. Cl.
CPC ...
H01L 27/1244 (2013.01); G02F 1/1368 (2013.01); G02F 1/136204 (2013.01); G02F 1/136286 (2013.01); H01L 27/0288 (2013.01); H01L 27/0292 (2013.01); H01L 27/1259 (2013.01); G02F 2001/136295 (2013.01);
Abstract
The present disclosure provides a method for fabricating an array substrate. The method includes providing a substrate; forming a first pattern on the substrate including a plurality of signal lines and a plurality of electrostatic discharge (ESD) lines, wherein an ESD line is configured to connect two signal lines; and removing a portion of each ESD line during a process for forming a second pattern over the first pattern to disconnect the two signal lines.