The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 31, 2017
Filed:
Mar. 14, 2016
Applicant:
Delta Electronics (Shanghai) Co., Ltd., Shanghai, CN;
Inventors:
Assignee:
DELTA ELECTRONICS (SHANGHAI) CO., LTD., Shanghai, CN;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/498 (2006.01); H01L 25/00 (2006.01); H01L 21/48 (2006.01); H01L 23/00 (2006.01); H01L 25/065 (2006.01); H01L 25/10 (2006.01); H01L 23/495 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49811 (2013.01); H01L 21/4853 (2013.01); H01L 23/49531 (2013.01); H01L 23/49548 (2013.01); H01L 23/49551 (2013.01); H01L 24/85 (2013.01); H01L 25/0655 (2013.01); H01L 25/105 (2013.01); H01L 25/50 (2013.01); H01L 23/3121 (2013.01); H01L 23/49575 (2013.01); H01L 2224/48227 (2013.01);
Abstract
A method of fabricating a package module includes placing a pin frame having plural pins on a circuit substrate; bonding the pins to corresponding bonding areas on a circuit substrate, thereby connecting the pins to the bonding areas; cutting off a connecting portion of the pin frame; and bending the pins to be vertical to the circuit substrate. By placing the pins on the corresponding bonding areas on the circuit substrate through the pin frame, and then cutting off the connecting portion of the pin frame and bending the pins, the efficiency of assembling the package module can be greatly promoted.