The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 31, 2017
Filed:
Jul. 22, 2016
Toyota Jidosha Kabushiki Kaisha, Toyota-shi Aichi-ken, JP;
Akinori Sakakibara, Toyota, JP;
Toyota Jidosha Kabushiki Kaisha, Toyota-shi, JP;
Abstract
A bonding member is a member shaped in a sheet and made of electrically-insulating resin. A semiconductor module includes a heatsink and a cooler that are electrically insulated from each other by the bonding member. The bonding member includes a central portion and a peripheral portion. A heat conductivity in a normal direction of the central portion is greater than a heat conductivity in the normal direction of the peripheral portion. Further, a heat conductivity in a surface direction of the peripheral portion is greater than a heat conductivity in the surface direction of the central portion. Further, the heat conductivity in the normal direction of the central portion is greater than the heat conductivity in the surface direction of the central portion.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile