The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 31, 2017
Filed:
Jan. 28, 2015
Applicant:
Lg Chem, Ltd., Seoul, KR;
Inventors:
Min Jin Ko, Daejeon, KR;
Kyung Mi Kim, Daejeon, KR;
Jae Ho Jung, Daejeon, KR;
Bum Gyu Choi, Daejeon, KR;
Min Kyoun Kim, Daejeon, KR;
Assignee:
LG CHEM, LTD., Seoul, KR;
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/56 (2010.01); H01L 23/29 (2006.01); C08G 77/12 (2006.01); C08G 77/20 (2006.01); C09J 183/04 (2006.01); C08G 77/00 (2006.01); C08G 77/08 (2006.01); C08G 77/38 (2006.01); C08L 83/04 (2006.01); C08K 5/5435 (2006.01); C08L 83/06 (2006.01); C08K 5/5419 (2006.01); C08G 77/14 (2006.01);
U.S. Cl.
CPC ...
H01L 23/296 (2013.01); C08G 77/08 (2013.01); C08G 77/12 (2013.01); C08G 77/20 (2013.01); C08G 77/38 (2013.01); C08G 77/80 (2013.01); C08K 5/5419 (2013.01); C08K 5/5435 (2013.01); C08L 83/04 (2013.01); C08L 83/06 (2013.01); C09J 183/04 (2013.01); H01L 33/56 (2013.01); C08G 77/14 (2013.01); C08G 2170/00 (2013.01); C08G 2190/00 (2013.01); C08K 2201/008 (2013.01); C08L 2201/08 (2013.01); C08L 2201/10 (2013.01); C08L 2203/206 (2013.01); C08L 2205/025 (2013.01); C09J 2203/318 (2013.01); H01L 2933/005 (2013.01); H01L 2933/0033 (2013.01);
Abstract
The present application relates to a cured product and the use thereof. The cured product has excellent processability, workability, and adhesive properties or the like, and does not cause whitening and surface stickiness, etc. The cured product has excellent transparency, moisture resistance, mechanical properties, and cracking resistance, etc. The cured product, for example, may be applied as an encapsulant or an adhesive material of a semiconductor device to provide a device having high long-term reliability.