The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 31, 2017
Filed:
Jan. 23, 2015
Applicant:
Kyocera Corporation, Kyoto-shi, Kyoto, JP;
Inventor:
Yoshiki Kawazu, Kyoto, JP;
Assignee:
KYOCERA CORPORATION, Kyoto-Shi, Kyoto, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 5/00 (2006.01); H01L 23/04 (2006.01); H01L 23/057 (2006.01); H01L 23/14 (2006.01); H01L 23/552 (2006.01); H01R 24/38 (2011.01); H01R 103/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/041 (2013.01); H01L 23/057 (2013.01); H01L 23/142 (2013.01); H01L 23/552 (2013.01); H01R 24/38 (2013.01); H05K 5/0069 (2013.01); H05K 5/0091 (2013.01); H01L 2924/0002 (2013.01); H01R 2103/00 (2013.01);
Abstract
An element-accommodating package which can improve frequency characteristics of an element-accommodating package having a coaxial connector, and a mounting structure are provided. An element-accommodating package includes a metallic substrate, a frame, a first coaxial connector, a second coaxial connector, and a circuit board. A groove is provided between one side of the frame and a side surface of the circuit board and between a first signal line and a second signal line.
Kawazu, Yoshiki. (2017). Element-accommodating package and mounting structure (U.S. Patent No. 9805995). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9805995
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile