The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 31, 2017

Filed:

Mar. 04, 2016
Applicant:

Shin-etsu Chemical Co., Ltd., Tokyo, JP;

Inventors:

Rie Kikuchi, Jyoetsu, JP;

Takeru Watanabe, Jyoetsu, JP;

Seiichiro Tachibana, Jyoetsu, JP;

Tsutomu Ogihara, Jyoetsu, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G03F 7/11 (2006.01); H01L 21/308 (2006.01); C08F 220/28 (2006.01); C09D 133/14 (2006.01); H01L 21/311 (2006.01); H01L 21/033 (2006.01); H01L 21/027 (2006.01); H01L 21/306 (2006.01); C08F 220/32 (2006.01); G03F 7/09 (2006.01);
U.S. Cl.
CPC ...
H01L 21/3086 (2013.01); C08F 220/28 (2013.01); C08F 220/32 (2013.01); C09D 133/14 (2013.01); G03F 7/094 (2013.01); H01L 21/0274 (2013.01); H01L 21/0276 (2013.01); H01L 21/0332 (2013.01); H01L 21/3081 (2013.01); H01L 21/30604 (2013.01); H01L 21/31116 (2013.01); H01L 21/31133 (2013.01); H01L 21/31138 (2013.01); H01L 21/31144 (2013.01); C08F 2220/281 (2013.01); C08F 2220/325 (2013.01);
Abstract

The invention provides a polymer for a resist under layer film composition, containing a repeating unit shown by the formula (1) and a repeating unit shown by the formula (3), wherein Rindependently represents a hydrogen atom or a methyl group; Rrepresents a group selected from the formulae (1-1) to (1-3); Rrepresents a saturated or unsaturated tertiary alkyl group having 4 to 20 carbon atoms and optionally containing an oxygen functional group; and Arepresents a single bond or a divalent linking group having 2 to 10 carbon atoms and containing an ester group, wherein the dotted line represents a bonding arm. There can be provided a polymer for a resist under layer film composition that is capable of forming a resist under layer film having good alkali aqueous hydrogen peroxide resistance, excellent filling and planarizing properties, and excellent dry etching property


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