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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9805871 B1

PDFFull Text
Date of Patent:
Oct. 31, 2017

Filed:

Nov. 16, 2016

Ceramic electronic component with low equivalent series resistance and method for manufacturing the same

Applicant:

Murata Manufacturing Co., Ltd., Nagaokakyo-shi, Kyoto-fu, JP;

Inventors:

Kosuke Onishi, Nagaokakyo, JP;

Tomohiro Sasaki, Nagaokakyo, JP;

Yasuhiro Nishisaka, Nagaokakyo, JP;

Akira Ishizuka, Nagaokakyo, JP;

Akihiro Yoshida, Nagaokakyo, JP;

Assignee:

MURATA MANUFACTURING CO., LTD., Kyoto, JP;

Attorney:

Keating & Bennett, LLP

Primary Examiner:

David M Sinclair

Int. Cl.
CPC ...
H01G 4/30 (2006.01); H01G 4/248 (2006.01); H01G 4/005 (2006.01); H01F 27/29 (2006.01); H01C 7/00 (2006.01); H01L 41/047 (2006.01); H01L 41/293 (2013.01); H01G 4/008 (2006.01); H01G 4/12 (2006.01); H01F 27/28 (2006.01);
U.S. Cl.
CPC ...
H01G 4/30 (2013.01); H01C 7/008 (2013.01); H01F 27/29 (2013.01); H01G 4/005 (2013.01); H01G 4/008 (2013.01); H01G 4/12 (2013.01); H01G 4/248 (2013.01); H01L 41/0472 (2013.01); H01L 41/293 (2013.01); H01F 27/2804 (2013.01); H01F 2027/2809 (2013.01);
Abstract

External electrodes, electrically connected to exposed portions of internal electrodes, are arranged on end surfaces of a ceramic main body of a laminated ceramic capacitor. Alloy layers of a metal contained in internal electrodes, and a metal contained in external electrodes, are arranged at the boundaries between external electrodes, and the ceramic main body and internal electrodes. Plating layers are provided on surfaces of external electrodes. A ceramic electronic component having a reduced ESR is thus provided.

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