logo

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9803847 B1

PDFFull Text
Date of Patent:
Oct. 31, 2017

Filed:

Apr. 22, 2014

Mounting arrangement and method for light emitting diodes

Applicant:

Fpt Acquisition Corp., Tustin, CA (US);

Inventors:

John Popovich, Solana Beach, CA (US);

Gregory W. Honegger, Bakersfield, CA (US);

Assignee:

FPT Acquisition Corp., Tustin, CA (US);

Attorney:

Klein, O'Neill & Singh, LLP

Primary Examiner:

Andrew Coughlin

Assistant Examiner:

Meghan Ulanday

Int. Cl.
CPC ...
F21V 29/00 (2015.01); F21V 29/70 (2015.01); A47C 7/72 (2006.01); F21K 9/00 (2016.01); F21V 19/00 (2006.01); G09F 9/33 (2006.01); G09F 13/22 (2006.01); H05K 1/02 (2006.01); F21V 29/74 (2015.01); F21K 9/90 (2016.01); H05K 3/32 (2006.01); F21K 9/60 (2016.01); F21V 29/507 (2015.01); F21V 7/00 (2006.01); H05K 3/00 (2006.01); F21Y 115/10 (2016.01); F21V 29/89 (2015.01); F21Y 103/10 (2016.01);
U.S. Cl.
CPC ...
F21V 29/70 (2015.01); A47C 7/725 (2013.01); F21K 9/00 (2013.01); F21K 9/60 (2016.08); F21K 9/90 (2013.01); F21V 19/001 (2013.01); F21V 29/507 (2015.01); F21V 29/74 (2015.01); G09F 9/33 (2013.01); G09F 13/22 (2013.01); H05K 1/0203 (2013.01); H05K 3/32 (2013.01); F21V 7/005 (2013.01); F21V 7/0025 (2013.01); F21V 29/89 (2015.01); F21Y 2103/10 (2016.08); F21Y 2115/10 (2016.08); H05K 3/0061 (2013.01); H05K 2201/10106 (2013.01); H05K 2201/10446 (2013.01); H05K 2201/10598 (2013.01); Y10S 362/80 (2013.01); Y10T 29/49133 (2015.01); Y10T 29/49826 (2015.01);
Abstract

A modular light emitting diode (LED) mounting configuration is provided including a light source module having a plurality of pre-packaged LEDs arranged in a serial array. The module includes a heat conductive body portion adapted to conduct heat generated by the LEDs to an adjacent heat sink. As a result, the LEDs are able to be operated with a higher current than normally allowed. Thus, brightness and performance of the LEDs is increased without decreasing the life expectancy of the LEDs. The LED modules can be used in a variety of illumination applications employing one or more modules.

Find Patent Forward Citations

Loading…