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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9802410 B1

PDFFull Text
Date of Patent:
Oct. 31, 2017

Filed:

Jul. 24, 2012

Ink jet print head

Applicant:

Hirotaka Miyazaki, Yokohama, JP;

Inventor:

Hirotaka Miyazaki, Yokohama, JP;

Assignee:

Canon Kabushiki Kaisha, Tokyo, JP;

Attorney:

Fitzpatrick, Cella, Harper & Scinto

Primary Examiner:

Alejandro Valencia

Int. Cl.
CPC ...
B41J 2/165 (2006.01); B41J 2/16 (2006.01); B29C 65/14 (2006.01); B29C 65/50 (2006.01); B29C 65/00 (2006.01); B29C 35/08 (2006.01); B29K 83/00 (2006.01); B29L 31/00 (2006.01); B41J 2/14 (2006.01); B29C 65/48 (2006.01);
U.S. Cl.
CPC ...
B41J 2/1623 (2013.01); B29C 65/1406 (2013.01); B29C 65/1412 (2013.01); B29C 65/4835 (2013.01); B29C 65/5057 (2013.01); B29C 66/53461 (2013.01); B29C 66/9672 (2013.01); B29C 2035/0827 (2013.01); B29K 2083/00 (2013.01); B29L 2031/767 (2013.01); B41J 2002/14362 (2013.01); B41J 2202/22 (2013.01); Y10T 29/49083 (2015.01); Y10T 29/49133 (2015.01); Y10T 29/49401 (2015.01); Y10T 156/10 (2015.01);
Abstract

A method of manufacturing an ink jet print head capable of bonding the printing element substrate to the support surface with high precision in a reduced period of time is provided. For this purpose, raised flat portions are formed in the support surface of the supporting member to provide in an adhesive layer between the printing element substrate and the supporting member a portion of the thermosetting adhesive that is thinner than others. After the relative positions of the printing element substrate and the supporting member are adjusted, the thin portions of the adhesive layer are hardened. This enables the printing element substrate to be bonded to the supporting member in a relatively short period of time. As a result, if there are undulations on the support surface, the printing element substrate can be bonded to the supporting member with high precision, improving the mass productivity of the print head.

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