The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 31, 2017
Filed:
Oct. 28, 2015
Applicant:
Panasonic Intellectual Property Management Co., Ltd., Osaka, JP;
Inventors:
Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B32B 27/36 (2006.01); C08L 71/02 (2006.01); B32B 3/08 (2006.01); C08G 59/24 (2006.01); C08G 59/56 (2006.01); B32B 27/38 (2006.01); C08L 3/02 (2006.01); C08L 63/00 (2006.01); B32B 7/04 (2006.01); B32B 27/08 (2006.01); B32B 27/20 (2006.01); B32B 3/30 (2006.01);
U.S. Cl.
CPC ...
B32B 27/36 (2013.01); B32B 27/38 (2013.01); C08G 59/245 (2013.01); C08G 59/56 (2013.01); C08L 63/00 (2013.01); C08L 71/02 (2013.01); B32B 3/08 (2013.01); B32B 3/30 (2013.01); B32B 7/045 (2013.01); B32B 27/08 (2013.01); B32B 27/20 (2013.01); B32B 2305/77 (2013.01); B32B 2307/202 (2013.01); B32B 2307/21 (2013.01); B32B 2307/50 (2013.01); B32B 2307/51 (2013.01); B32B 2307/546 (2013.01); B32B 2307/552 (2013.01); B32B 2307/734 (2013.01); B32B 2457/00 (2013.01); B32B 2457/20 (2013.01); B32B 2571/00 (2013.01);
Abstract
Provided is a structural member for electronic devices which uses a material that is flexible and has excellent restoration properties after extension and stress relaxation properties. The structural member for electronic devices has the following properties A and B: (Property A) In a case where predetermined deformation is applied, stress that applies the deformation is relaxed (reduced) with time: and (Property B) In a case where the stress that applies deformation is 0, the deformation rarely remains while a resin composition is recovered. That is, when stress is 0, residual strain substantially becomes 0 (specifically 3% or lower).