The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 31, 2017

Filed:

Oct. 30, 2013
Applicants:

Nippon Sheet Glass Co., Ltd., Tokyo, JP;

Pilkington Group Limited, Lathom, GB;

Inventors:

Hisashi Ogawa, Sagamihara, JP;

Hisashi Asaoka, Sagamihara, JP;

Mark A. Chamberlain, Lathom, GB;

Assignees:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B32B 17/10 (2006.01); B32B 3/26 (2006.01); H05B 3/84 (2006.01); H05B 3/06 (2006.01); H01L 51/52 (2006.01);
U.S. Cl.
CPC ...
B32B 17/10385 (2013.01); B32B 3/266 (2013.01); B32B 17/10036 (2013.01); B32B 17/10293 (2013.01); B32B 17/10467 (2013.01); B32B 17/10541 (2013.01); B32B 17/10651 (2013.01); B32B 17/10761 (2013.01); H05B 3/06 (2013.01); H05B 3/84 (2013.01); B32B 2457/12 (2013.01); B32B 2457/20 (2013.01); B32B 2457/202 (2013.01); B32B 2457/206 (2013.01); H01L 51/5203 (2013.01);
Abstract

Cracking of a laminated glass assembly having a device encapsulated therein during the manufacturing process is prevented. The laminated glass assembly includes a first and a second glass sheet; a first, a second and a third intermediate film interposed between the first and second glass sheets, in that order; an organic EL panel interposed between the first and second intermediate films and provided with a terminal member; and a first wiring member consisting of a metallic thin strip connected to the terminal member in a thickness-wise direction via a first solder; wherein at least one of the two glass sheets has a thickness of 1.0 mm to 1.6 mm; and at a connecting portion of the terminal member, the first solder and the first wiring member, the first wiring member has a thickness of 0.05 mm to 0.10 mm and a width of 3 mm to 15 mm, and the first solder has a thickness of 0.01 mm to 0.20 mm; and a total thickness of the terminal member, the first solder and the first wiring member is 0.16 mm to 0.40 mm.


Find Patent Forward Citations

Loading…