The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 31, 2017
Filed:
Dec. 31, 2014
Applicant:
Alpha Assembly Solutions Inc., Waterbury, CT (US);
Inventors:
Morgana de Avila Ribas, Bangalore, IN;
Rahul Raut, Edison, NJ (US);
Traian Cornel Cucu, South Plainfield, NJ (US);
Shu Tai Yong, Singapore, SG;
Siuli Sarkar, Bangalore, IN;
Ramakrishna Hosur Katagiriyappa, Bangalore, IN;
Assignee:
Other;
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/09 (2006.01); B23K 35/362 (2006.01); B23K 35/26 (2006.01); B23K 35/36 (2006.01); B23K 35/02 (2006.01); H05K 1/11 (2006.01); H05K 9/00 (2006.01);
U.S. Cl.
CPC ...
B23K 35/362 (2013.01); B23K 35/025 (2013.01); B23K 35/262 (2013.01); B23K 35/3612 (2013.01); H05K 1/09 (2013.01); H05K 1/111 (2013.01); H05K 9/0024 (2013.01); H05K 2201/032 (2013.01);
Abstract
Rosin-free thermosetting flux formulations for enhancing the mechanical reliability of solder joints. In accordance with one or more aspects, a solder paste as shown and described herein imparts improved or enhanced solder joint properties relating to at least one of drop shock, thermal cycling, thermal shock, shear strength, flexural strength performance, and/or other thermal-mechanical performance attributes.