The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 31, 2017
Filed:
May. 18, 2016
Sungwoo Hitech Co., Ltd., Busan, KR;
Rae Hyeong Kim, Busan, KR;
Mun Yong Lee, Busan, KR;
SUNGWOO HITECH CO., LTD., Busan, KR;
Abstract
A multi-warm forming device and the forming method are disclosed. A multi-warm forming device according to one or a plurality of exemplary embodiments of the present invention may include: a lower mold die that is disposed on a bolster for a process and in which a mold mounting portion having at least one space portion is formed at a center thereof; a lower mold that is disposed at an upper surface of a mold mounting portion of the lower mold die, in which a plurality of gas supply passages formed therein in a vertical direction are connected to a gas supply device of an outside through a gas supply line, and a lower forming surface is formed at an upper surface thereof; an upper mold that is mounted on a slider of an upper portion to be able to be moved up and down corresponding to the lower mold at an upper portion of the lower mold die, in which an upper forming surface is formed at a lower surface corresponding to the lower mold, an upper mold face surface is formed at a circumference of the upper forming surface, and a plurality of heating cartridges are mounted inside along the upper forming surface and the upper mold face surface; and a blank holder of which the mold mounting portion is inserted into a penetration hole that is formed corresponding to the mold mounting portion, is able to be moved in a vertical direction by a guide post and a cushion spring that are mounted within the lower mold die, and in which a plurality of heating cartridges are mounted along a holder face surface that restrains a material together with the upper mold face surface at an early stage of a forming process.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile