The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 31, 2017

Filed:

Jan. 30, 2014
Applicants:

Dow Corning Corporation, Midland, MI (US);

Dow Corning China Holding Co., Ltd., Shanghai, CN;

Dow Corning Europe S.a., Seneffe, BE;

Inventors:

Hortense Baillet, Le Havre, FR;

Jean-Luc Garaud, Nivelles, FR;

Lenin Petroff, Bay City, MI (US);

Isabelle Van Reeth, Pudong, CN;

Assignee:

Dow Corning Corporation, Midland, MI (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
A61K 8/891 (2006.01); A61K 8/34 (2006.01); A61K 8/81 (2006.01); A61K 8/04 (2006.01); A61K 8/06 (2006.01); A61K 8/41 (2006.01); A61K 8/44 (2006.01); A61K 8/37 (2006.01); A61K 8/31 (2006.01); A61Q 17/00 (2006.01);
U.S. Cl.
CPC ...
A61K 8/891 (2013.01); A61K 8/042 (2013.01); A61K 8/062 (2013.01); A61K 8/064 (2013.01); A61K 8/31 (2013.01); A61K 8/345 (2013.01); A61K 8/37 (2013.01); A61K 8/41 (2013.01); A61K 8/44 (2013.01); A61K 8/8152 (2013.01); A61Q 17/00 (2013.01); A61K 2800/805 (2013.01);
Abstract

Provided in various embodiments are compositions for topical application to the skin of a mammal, methods for their preparation, and their uses in skin care compositions to reduce adhesion of unwanted particles to the skin. When a hydrophobic non-volatile solvent and a hydrophobic non-volatile high melting point material with a melting point in the range of 60° C. and 100° C. are combined with a hydrophobic volatile solvent which compatibilizes the hydrophobic non-volatile solvent and the hydrophobic non-volatile high melting point material and the hydrophobic non-volatile high melting point material is selected to be at least partially incompatible with the hydrophobic non-volatile solvent in the absence of the hydrophobic volatile solvent, the resulting composition may be applied to skin to reduce adhesion of unwanted particles to the skin.


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