The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 24, 2017

Filed:

Jul. 18, 2014
Applicant:

Murata Manufacturing Co., Ltd., Nagaokakyo-shi, Kyoto-fu, JP;

Inventors:

Kazuto Ogawa, Nagaokakyo, JP;

Takashi Watanabe, Nagaokakyo, JP;

Junya Shimakawa, Nagaokakyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/00 (2006.01); H05K 1/14 (2006.01); H05K 3/34 (2006.01);
U.S. Cl.
CPC ...
H05K 3/0052 (2013.01); H05K 1/141 (2013.01); H05K 3/3442 (2013.01); H05K 2201/049 (2013.01); H05K 2201/0909 (2013.01); H05K 2201/09181 (2013.01); H05K 2201/09645 (2013.01); H05K 2201/10636 (2013.01); H05K 2203/0191 (2013.01); H05K 2203/1563 (2013.01); Y02P 70/611 (2015.11); Y10T 29/4913 (2015.01);
Abstract

A method of producing electronic components each including a substrate-type terminal and a device connected to the substrate-type terminal is performed such that the substrate-type terminal includes a substrate body including a rectangular or substantially rectangular first principal surface extending in first and second directions perpendicular or substantially perpendicular to each other. The device is disposed on the first principal surface. The method includes supporting a substrate that is to become an assembly in which the plurality of substrate-type terminals are arranged in a matrix using a first support member, cutting the substrate supported by the first support member into the plurality of substrate-type terminals, and mounting the device on the first principal surface of the substrate body of each of the plurality of substrate-type terminals obtained by cutting.


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