The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 24, 2017

Filed:

Aug. 08, 2014
Applicant:

Flextronics Ap, Llc, Broomfield, CO (US);

Inventors:

Weifeng Liu, Dublin, CA (US);

Zhen Feng, San Jose, CA (US);

Anwar Mohammed, San Jose, CA (US);

David Geiger, Dublin, CA (US);

Murad Kurwa, San Jose, CA (US);

Assignee:

Flextronics AP, LLC, Broomfield, CO (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/14 (2006.01); H05K 3/24 (2006.01); H05K 1/02 (2006.01); H01R 12/52 (2011.01); H05K 3/30 (2006.01); H05K 3/00 (2006.01);
U.S. Cl.
CPC ...
H05K 1/14 (2013.01); H01R 12/52 (2013.01); H05K 1/0271 (2013.01); H05K 3/0085 (2013.01); H05K 3/241 (2013.01); H05K 3/303 (2013.01); H05K 2201/04 (2013.01); H05K 2201/068 (2013.01); H05K 2201/10734 (2013.01); H05K 2201/2045 (2013.01); H05K 2203/0338 (2013.01); H05K 2203/0723 (2013.01);
Abstract

A compliant interconnect with a cylindrical bellows structure is configured to reduce a stress between a substrate and a PCB board. The stress can be caused by a CTE (coefficient of thermal expansion) mismatch, a physical movement, or a combination thereof. The compliant interconnect can be solder to and/or immobilized on one or more coupling structure. Alternatively, the compliant interconnect can include an instant swapping structure (such as a socket) that makes the upgrade of the electronic components easier.


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