The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 24, 2017

Filed:

Nov. 04, 2016
Applicant:

Tacto Tek Oy, Kempele, FI;

Inventors:

Antti Keranen, Oulu, FI;

Jarmo Saaski, Kempele, FI;

Mikko Heikkinen, Oulu, FI;

Assignee:

TactoTek Oy, Kempele, FI;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/00 (2006.01); H05K 1/02 (2006.01); H05K 1/11 (2006.01); H05K 1/16 (2006.01); H05K 1/18 (2006.01); H05K 3/00 (2006.01); H05K 3/28 (2006.01);
U.S. Cl.
CPC ...
H05K 1/028 (2013.01); H05K 1/0274 (2013.01); H05K 1/111 (2013.01); H05K 1/16 (2013.01); H05K 1/181 (2013.01); H05K 3/0044 (2013.01); H05K 3/284 (2013.01); H05K 2201/10106 (2013.01); H05K 2201/10143 (2013.01); H05K 2201/10151 (2013.01); H05K 2203/1105 (2013.01); H05K 2203/1316 (2013.01); H05K 2203/1327 (2013.01); H05K 2203/166 (2013.01);
Abstract

A multilayer structure () including a preferably flexible substrate film () capable of accommodating electronics (), such as conductive traces and optionally electronic components such as SMDs (surface-mount device), on a first side thereof, the film having the first side and a second side, and a plastic layer () molded onto the first side of the substrate and protruding at one or more locations (B) through the substrate onto the second side, forming one or more protrusions () on the second side having a predetermined function. A corresponding method of manufacture is presented.


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