The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 24, 2017

Filed:

Jun. 01, 2016
Applicant:

Toyota Jidosha Kabushiki Kaisha, Toyota-shi, Aichi-ken, JP;

Inventor:

Shotaro Ishikawa, Yokohama, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B01J 23/00 (2006.01); H01M 4/86 (2006.01); C23C 18/54 (2006.01); H01M 4/92 (2006.01);
U.S. Cl.
CPC ...
H01M 4/8657 (2013.01); C23C 18/54 (2013.01); H01M 4/926 (2013.01);
Abstract

A copper-coated palladium-containing particle dispersion in which copper-coated palladium-containing particles, which are obtained by coating surfaces of palladium-containing particles with copper, are dispersed is prepared, a platinum ion-containing solution is prepared, and a shell is formed by mixing the copper-coated palladium-containing particle dispersion and the platinum ion-containing solution with each other in a microreactor to displace copper of the copper-coated palladium-containing particle surfaces with platinum. The microreactor includes at least a first supply flow path, a second supply flow path, a joint portion in which the first supply flow path and the second supply flow path are joined to each other, and a discharge flow path. An orifice portion is provided midway in the discharge flow path. A pressure applied to the orifice portion in the displacement step is 2 MPa or higher.


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