The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 24, 2017

Filed:

Oct. 09, 2015
Applicant:

SK Hynix Inc., Icheon-Si, KR;

Inventors:

Min-Suk Lee, Icheon-Si, KR;

Chang-Hyup Shin, Icheon-Si, KR;

Assignee:

SK hynix Inc., Icheon-Si, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 43/12 (2006.01); G11C 13/00 (2006.01); H01L 43/08 (2006.01); H01L 45/00 (2006.01); H01L 43/02 (2006.01); G11C 27/00 (2006.01);
U.S. Cl.
CPC ...
H01L 43/12 (2013.01); G11C 13/0004 (2013.01); H01L 43/02 (2013.01); H01L 43/08 (2013.01); H01L 45/04 (2013.01); H01L 45/06 (2013.01); H01L 45/08 (2013.01); H01L 45/085 (2013.01); H01L 45/1233 (2013.01); H01L 45/1253 (2013.01); H01L 45/141 (2013.01); H01L 45/146 (2013.01); H01L 45/147 (2013.01); H01L 45/1675 (2013.01); G11C 27/00 (2013.01); G11C 2213/52 (2013.01);
Abstract

A method of manufacturing an electronic device including a semiconductor memory is provided. The method may include forming a material layer for forming a variable resistance element over a substrate, forming a metal layer over the material layer, forming a mask pattern over the metal layer, forming a metal layer pattern by etching the metal layer using the mask pattern as an etch barrier, performing a surface treatment on the metal layer pattern, and etching the material layer using the metal layer pattern and the metal compound layer as an etch barrier to form a variable resistance element having an external side aligned with an external side of the metal compound layer. An external part of the metal layer pattern may be transformed into a metal compound layer. The metal compound layer may have a low etch rate as an etch barrier.


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