The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 24, 2017

Filed:

Oct. 31, 2016
Applicant:

Eastman Kodak Company, Rochester, NY (US);

Inventors:

Shelby Forrester Nelson, Pittsford, NY (US);

Carolyn Rae Ellinger, Rochester, NY (US);

Assignee:

EASTMAN KODAK COMPANY, Rochester, NY (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 29/66 (2006.01); H01L 29/40 (2006.01); H01L 21/285 (2006.01); H01L 21/3065 (2006.01); H01L 29/423 (2006.01); H01L 29/417 (2006.01);
U.S. Cl.
CPC ...
H01L 29/66742 (2013.01); H01L 21/28556 (2013.01); H01L 21/3065 (2013.01); H01L 29/401 (2013.01); H01L 29/41733 (2013.01); H01L 29/42384 (2013.01);
Abstract

A method of forming a thin-film transistor includes providing a substrate having a top surface and a recess in the top surface. An electrically conductive gate is provided within the recess. A conformal insulating material layer and a conformal semiconductor material layer are formed in the recess, with the semiconductor material layer extending over the top surface of the substrate outside of the recess. Source and drain electrodes are formed by adding a deposition inhibitor material on a portion of the substrate including within the recess; and depositing a thin-film of electrically conductive material, wherein the deposition inhibitor material inhibits the deposition of the electrically conductive material such that the electrically conductive material is patterned by the deposition inhibitor material during deposition, wherein the patterned electrically conductive material provides the source electrode on a first side of the recess and the drain electrode on a second side of the recess.


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