logo

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9799686 B1

PDFFull Text
Date of Patent:
Oct. 24, 2017

Filed:

Sep. 09, 2013

Millimetre wave integrated circuits with thin film transistors

Applicants:

Ishiang Shih, Brossard, CA;

Cindy X. Qiu, Brossard, CA;

Chunong Qiu, Brossard, CA;

Yi-chi Shih, Los Angeles, CA (US);

Inventors:

Ishiang Shih, Brossard, CA;

Cindy X. Qiu, Brossard, CA;

Chunong Qiu, Brossard, CA;

Yi-Chi Shih, Los Angeles, CA (US);

Assignee:

Other;

Attorney:
Primary Examiner:

David Vu

Assistant Examiner:

Mouloucoulaye Inoussa

Int. Cl.
CPC ...
H01L 27/13 (2006.01); H01L 21/84 (2006.01); H01L 27/12 (2006.01); H01L 29/423 (2006.01); H01L 21/02 (2006.01); H01L 21/4757 (2006.01); H01L 21/4763 (2006.01); H01L 49/02 (2006.01); H01L 29/24 (2006.01); H01L 29/66 (2006.01);
U.S. Cl.
CPC ...
H01L 27/1259 (2013.01); H01L 21/02565 (2013.01); H01L 21/47573 (2013.01); H01L 21/47635 (2013.01); H01L 27/124 (2013.01); H01L 27/1218 (2013.01); H01L 27/1225 (2013.01); H01L 27/1255 (2013.01); H01L 28/20 (2013.01); H01L 28/40 (2013.01); H01L 29/24 (2013.01); H01L 29/42384 (2013.01); H01L 29/66969 (2013.01);
Abstract

MMIC circuits with thin film transistors are provided without the need of grinding and etching of the substrate after the fabrication of active and passive components. Furthermore, technology for active devices based on non-toxic compound semiconductors is provided. The success in the MMIC methods and structures without substrate grinding/etching and the use of semiconductors without toxic elements for active components will reduce manufacturing time, decrease economic cost and environmental burden. MMIC structures are provided where the requirements for die or chip attachment, alignment and wire bonding are eliminated completely or minimized. This will increase the reproducibility and reduce the manufacturing time for the MMIC circuits and modules.

Find Patent Forward Citations

Loading…