The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 24, 2017

Filed:

Jul. 13, 2016
Applicant:

SK Hynix Inc., Gyeonggi-do, KR;

Inventor:

Seung-Hwan Kim, Gyeonggi-do, KR;

Assignee:

SK Hynix Inc., Gyeonggi-do, KR;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 29/66 (2006.01); H01L 27/108 (2006.01); H01L 29/06 (2006.01); H01L 29/423 (2006.01); H01L 29/40 (2006.01); H01L 29/10 (2006.01);
U.S. Cl.
CPC ...
H01L 27/10885 (2013.01); H01L 27/10823 (2013.01); H01L 27/10876 (2013.01); H01L 29/0638 (2013.01); H01L 29/0649 (2013.01); H01L 29/1083 (2013.01); H01L 29/407 (2013.01); H01L 29/4236 (2013.01);
Abstract

A semiconductor device may include: a semiconductor substrate comprising a plurality of active regions and a device isolation region for isolating the plurality of active regions; and a conductive shield pillar formed in the device isolation region and connected to the semiconductor substrate. Each of the active regions may include: a body portion formed in the substrate; a pillar floating from the body portion and positioned over the body portion; a side portion provided over a side surface of the pillar and connected to the body portion; and an embedded spacer positioned between the side portion and the pillar, the pillar may be coupled to the substrate through the side portion.


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