The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 24, 2017

Filed:

Mar. 04, 2015
Applicants:

Sang Hoon Ahn, Goyang-si, KR;

Sangho Rha, Seongnam-si, KR;

Jongmin Baek, Suwon-si, KR;

Wookyung You, Suwon-si, KR;

Nae-in Lee, Seoul, KR;

Inventors:

Sang Hoon Ahn, Goyang-si, KR;

Sangho Rha, Seongnam-si, KR;

Jongmin Baek, Suwon-si, KR;

Wookyung You, Suwon-si, KR;

Nae-In Lee, Seoul, KR;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/532 (2006.01); H01L 21/768 (2006.01); H01L 23/522 (2006.01);
U.S. Cl.
CPC ...
H01L 23/53295 (2013.01); H01L 21/7682 (2013.01); H01L 21/76826 (2013.01); H01L 21/76832 (2013.01); H01L 21/76835 (2013.01); H01L 23/5222 (2013.01); H01L 23/5226 (2013.01); H01L 21/76805 (2013.01); H01L 21/76807 (2013.01); H01L 21/76885 (2013.01); H01L 23/53223 (2013.01); H01L 23/53238 (2013.01); H01L 23/53266 (2013.01); H01L 2924/0002 (2013.01);
Abstract

A semiconductor device includes a first conductive pattern on a substrate, an insulating diffusion barrier layer conformally covering a surface of the first conductive pattern, the insulation diffusion barrier layer exposed by an air gap region adjacent to a sidewall of the first conductive pattern, and a second conductive pattern on the first conductive pattern, the second conductive pattern penetrating the insulating diffusion barrier layer so as to be in contact with the first conductive pattern.


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