The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 24, 2017

Filed:

Feb. 06, 2017
Applicant:

Vanguard International Semiconductor Corporation, Hsinchu, TW;

Inventors:

Ming-Sheng Hsu, Taibao, TW;

Li-Che Chen, Hsinchu, TW;

Hsing-Chao Liu, Jhudong Township, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/52 (2006.01); H01L 23/525 (2006.01); H01L 23/528 (2006.01); H01L 23/522 (2006.01); H01L 23/532 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5256 (2013.01); H01L 23/528 (2013.01); H01L 23/5226 (2013.01); H01L 23/53295 (2013.01);
Abstract

A fuse element includes a metal layer disposed on a substrate. The metal layer includes an intermediate segment, a first block and a second block. The first block and the second block are electrically connected to two respective ends of the intermediate segment. The fuse element also includes a dielectric layer covering the intermediate segment, the first block and the second block, a first passivation layer disposed on the dielectric layer, and a second passivation layer disposed on the first passivation layer. The fuse element further includes an opening penetrating through the first passivation layer, the second passivation layer and a portion of the dielectric layer, and located above the intermediate segment. In addition, a protective film is disposed on a bottom and a portion of a sidewall of the opening, and covers the first passivation layer exposed by the opening.


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