The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 24, 2017

Filed:

Nov. 18, 2014
Applicant:

Linxens Microtech, Vorey, FR;

Inventor:

Eric Eymard, Aiguilhe, FR;

Assignee:

Linxens Holding, Mantes-la-Jolie, FR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/02 (2006.01); H01L 23/498 (2006.01); H01L 21/48 (2006.01); H01L 23/66 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49855 (2013.01); H01L 21/486 (2013.01); H01L 23/49827 (2013.01); H01L 23/49838 (2013.01); H01L 23/66 (2013.01); H01L 2223/6677 (2013.01); H01L 2924/0002 (2013.01);
Abstract

Method for producing at least one electronic chip support, from a plate that includes a first face intended to be in contact with a chip reader, a second face, covered with a first layer of electrically conductive material and intended to be linked to a radio antenna, and a core made from an electrically insulating material separating the first face from the second face. This method includes steps of drilling at least one through hole through the plate, depositing a layer of electrically conductive material on the first face and chemically etching a first electric circuit and a second electric circuit on the first face and the second face respectively. Prior to the chemical etching step, a step of depositing a third layer of electrically conductive material in the hole or holes, which covers the electrically insulating material in the corresponding hole or holes.


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