The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 24, 2017

Filed:

Apr. 09, 2014
Applicants:

Inventec (Pudong) Technology Corporation, Shanghai, CN;

Inventec Corporation, Taipei, TW;

Inventors:

Chih-Ming Weng, Taipei, TW;

Yi-Lun Cheng, Taipei, TW;

Chun-Lung Lin, Taipei, TW;

Assignees:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/427 (2006.01); H05K 7/20 (2006.01); B29C 45/00 (2006.01); F28D 20/02 (2006.01);
U.S. Cl.
CPC ...
H01L 23/4275 (2013.01); B29C 45/0001 (2013.01); F28D 20/023 (2013.01); H05K 7/2039 (2013.01); H01L 2924/0002 (2013.01); Y02E 60/145 (2013.01);
Abstract

A method for forming a case for an electronic device and a manufactured case structure for an electronic device are provided. The method for forming a case for an electronic device comprises the following steps. Provide a plastic material. Provide a plurality of PCM microcapsules. Mix the plastic material and the plurality of PCM microcapsules so as to form a housing material. Form a case from the housing material by injection molding. The manufactured case structure for an electronic device comprises a plastic layer and a plurality of PCM microcapsules. The plurality of PCM microcapsules are dispersed in the plastic layer.


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