The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 24, 2017

Filed:

May. 06, 2015
Applicant:

Samsung Electronics Co., Ltd., Suwon-si, Gyeonggi-do, KR;

Inventors:

Ji-Cheol Hong, Hwaseong-si, KR;

Young-Jin Cho, Seoul, KR;

Dong-Gi Lee, Yongin-si, KR;

Hee-Chang Cho, Seoul, KR;

Assignee:

Samsung Electronics Co., Ltd., Suwon-si, Gyeonggi-do, KR;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G11C 17/00 (2006.01); G11C 29/52 (2006.01); G06F 13/16 (2006.01); G11C 5/04 (2006.01);
U.S. Cl.
CPC ...
G11C 29/52 (2013.01); G06F 13/1684 (2013.01); G11C 5/04 (2013.01);
Abstract

A memory module set includes a main integrated circuit (IC) for transmitting and receiving an electrical signal, a first group of memory modules including at least one memory module having a first pin unit connected to the main IC, and a second group of memory modules including at least one memory module having a second pin unit connected to the main IC. The groups of memory modules and the main IC are arrayed in a first direction on a substrate, and the second group of memory modules is offset with respect to the first group of memory modules in a second direction that is perpendicular to the first direction so as to have a position relative to the main IC in the second direction that is different from that of the first group of memory modules.


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