The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 24, 2017

Filed:

Dec. 10, 2013
Applicants:

Boe Technology Group Co., Ltd., Beijing, CN;

Chengdu Boe Optoelectronics Technology Co., Ltd.;

Inventors:

Wei He, Beijing, CN;

Junping Bao, Beijing, CN;

Xinghua Li, Beijing, CN;

Seung Yik Park, Beijing, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09J 9/02 (2006.01); C09J 7/02 (2006.01); H01L 23/00 (2006.01); C08K 9/08 (2006.01); C08K 9/10 (2006.01);
U.S. Cl.
CPC ...
C09J 7/026 (2013.01); C09J 7/0239 (2013.01); C09J 9/02 (2013.01); H01L 24/29 (2013.01); C08K 9/08 (2013.01); C08K 9/10 (2013.01); C09J 2203/326 (2013.01); C09J 2205/102 (2013.01); C09J 2205/11 (2013.01); C09J 2463/00 (2013.01); C09J 2467/006 (2013.01); H01L 2224/2929 (2013.01); H01L 2924/0665 (2013.01); H01L 2924/07811 (2013.01); H01L 2924/15788 (2013.01); Y10T 428/2438 (2015.01); Y10T 428/24364 (2015.01); Y10T 428/2984 (2015.01);
Abstract

The invention provides an anisotropic conductive adhesive film and an electronic device. The anisotropic conductive adhesive film comprises a base film and microcapsule structures, wherein the microcapsule structures are set on the base film, and each of the microcapsule structures comprises a metallic conductive particle, a normal-temperature curable macromolecular polymer coated on the outside of the metallic conductive particle and a microcapsule wall coated on the outside of the macromolecular polymer, and an adhesive glue is adhered to the external surface of the microcapsule wall. When in use, the microcapsule structure is destroyed by pressurizing, the conductive particle and the normal-temperature curable macromolecular polymer contained inside the microcapsule wall leak out, and the normal-temperature curable macromolecular polymer leaked out is cured, so that electrical conduction and connection of a microelectronic apparatus can be achieved at normal temperature via the anisotropic conductive adhesive film.


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