The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 24, 2017
Filed:
Jun. 04, 2012
Jonathan R. Coppeta, Windham, NH (US);
Kurt Shelton, Woburn, MA (US);
Norman F. Sheppard, Jr., New Ipswich, NH (US);
Douglas Snell, Amesbury, MA (US);
Catherine M. B. Santini, North Chelmsford, MA (US);
Jonathan R. Coppeta, Windham, NH (US);
Kurt Shelton, Woburn, MA (US);
Norman F. Sheppard, Jr., New Ipswich, NH (US);
Douglas Snell, Amesbury, MA (US);
Catherine M. B. Santini, North Chelmsford, MA (US);
Microchips Biotech, Inc., Lexington, MA (US);
Abstract
Compression cold welding methods, joint structures, and hermetically sealed containment devices are provided. The method includes providing a first substrate having at least one first joint structure which comprises a first joining surface, which surface comprises a first metal; providing a second substrate having at least one second joint structure which comprises a second joining surface, which surface comprises a second metal; and compressing together the at least one first joint structure and the at least one second joint structure to locally deform and shear the joining surfaces at one or more interfaces in an amount effective to form a metal-to-metal bond between the first metal and second metal of the joining surfaces. Overlaps at the joining surfaces are effective to displace surface contaminants and facilitate intimate contact between the joining surfaces without heat input. Hermetically sealed devices can contain drug formulations, biosensors, or MEMS devices.