The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 24, 2017

Filed:

Dec. 11, 2015
Applicant:

Corning Incorporated, Corning, NY (US);

Inventors:

Qingya Wang, Shanghai, CN;

Yongsheng Yan, Fuzhou, CN;

Fang-Fang Wang, Zhubei, TW;

Assignee:

CORNING INCORPORATED, Corning, NY (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B41J 2/01 (2006.01); B41J 11/00 (2006.01); B41M 5/00 (2006.01); B41M 7/00 (2006.01); B41M 5/24 (2006.01);
U.S. Cl.
CPC ...
B41J 11/0015 (2013.01); B41M 5/007 (2013.01); B41M 5/0047 (2013.01); B41M 7/009 (2013.01); B41M 5/0058 (2013.01); B41M 5/0064 (2013.01); B41M 5/24 (2013.01);
Abstract

A method of printing a decoration on a substrate include inkjet printing a plurality of inks to form a layer having a predetermined pattern on a surface of the substrate, wherein each of the inks includes a solvent and has a different color; heating the substrate to evaporate at least a portion of the solvent in each of the plurality of inks; and thermally curing the layer after evaporating at least the portion of the solvent in each of the plurality of inks to form the decoration. The substrate is heated to a temperature that evaporates at least the portion of the solvent in each of the plurality of inks without fully curing the plurality of inks. A boiling point of the solvent in each of the plurality of inks is within 10° C. of each other.


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