The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9796162 B1

PDF
Full Text
Expired
Date of Patent:
Oct. 24, 2017

Filed:

Apr. 10, 2014
Applicant:

Moo Print Limited, London, GB;

Inventor:

Paul Thorogood, London, GB;

Assignee:

MOO PRINT LIMITED, London, GB;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G06K 19/06 (2006.01); B32B 37/02 (2006.01); B32B 37/12 (2006.01); B32B 38/00 (2006.01); B42D 15/00 (2006.01); B42D 15/02 (2006.01); G06K 19/077 (2006.01); G06K 19/07 (2006.01); B42D 25/47 (2014.01); B42D 25/485 (2014.01);
U.S. Cl.
CPC ...
B32B 37/02 (2013.01); B32B 37/12 (2013.01); B32B 38/145 (2013.01); B42D 15/0093 (2013.01); B42D 15/02 (2013.01); G06K 19/072 (2013.01); G06K 19/0723 (2013.01); G06K 19/07718 (2013.01); G06K 19/07722 (2013.01); B32B 2305/342 (2013.01); B32B 2317/12 (2013.01); B32B 2425/00 (2013.01); B32B 2519/02 (2013.01); B42D 25/47 (2014.10); B42D 25/485 (2014.10); B42D 2033/28 (2013.01); B42D 2033/46 (2013.01); G06K 19/07716 (2013.01);
Abstract

A multiple ply printed product and a method of producing it are described. The method comprises providing a substrate layer having a first surface supporting at least one wireless communication chip and a second surface, reverse to the first surface. A first paper stock having a first surface and a second surface is also provided. A first bonding operation is performed to substantially bond together the first surface of the substrate layer and the second surface of the first paper stock, to sandwich the wireless communication chip between the first paper stock and the substrate layer; providing a second paper stock having a first surface and a second surface. At least one of the first surface of the first paper stock and the second surface of the second paper stock may be printed on. A second bonding operation is performed to bond together the first surface of the second paper stock and the second surface of the substrate layer, to form a multiple ply printed product where the first surface of the substrate layer supports a plurality of wireless communication chips and the multiple ply printed product is a sheet on which is printed a plurality of business cards, each business card corresponding to a respective wireless communication chip.


Find Patent Forward Citations

Loading…