The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 24, 2017
Filed:
Sep. 10, 2012
Yoya Fukuda, Numazu, JP;
Kenichi Hayashi, Shizuoka, JP;
Takashi Komai, Shizuoka, JP;
Yusuke Urushibata, Shizuoka, JP;
Yusuke Tomita, Shizuoka, JP;
Yoya Fukuda, Numazu, JP;
Kenichi Hayashi, Shizuoka, JP;
Takashi Komai, Shizuoka, JP;
Yusuke Urushibata, Shizuoka, JP;
Yusuke Tomita, Shizuoka, JP;
Kimura Chuzosho Co., Ltd., Shizuoka, JP;
Abstract
According to the invention, by setting the linear thermal expansion amount when a mold made of a molding sand is heated from a room temperature to 1000° C. to be not more than 0.9%, and the ratio (D/d) between the diameter of a slump (D) and the diameter of a slump cone (d) in a slump test of the molding sand having a hardening agent kneaded to be not less than 1.65, a molding sand preferable for use in a mold produced using the self-hardening type of three dimensional laminate molding sand mold, having low thermal expansibility preventing occurrence of a veining defect, and capable of forming a large and complicated shape can be obtained.