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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9795053 B1

PDFFull Text
Date of Patent:
Oct. 17, 2017

Filed:

Jun. 17, 2014

Electronic device and method for manufacturing the electronic device

Applicant:

Denso Corporation, Kariya, Aichi-pref., JP;

Inventors:

Yuki Sanada, Kariya, JP;

Atsushi Kashiwazaki, Kariya, JP;

Assignee:

DENSO CORPORATION, Kariya, JP;

Attorney:

Posz Law Group, PLC

Primary Examiner:

Hoa C Nguyen

Assistant Examiner:

Christopher L Augustin

Int. Cl.
CPC ...
H05K 1/18 (2006.01); H05K 7/20 (2006.01); H01L 23/31 (2006.01); H01L 23/13 (2006.01); H01L 23/32 (2006.01); H01L 23/42 (2006.01); H01L 23/433 (2006.01); B29C 45/14 (2006.01); H01L 21/56 (2006.01); B29C 45/34 (2006.01); H01L 25/16 (2006.01);
U.S. Cl.
CPC ...
H05K 7/20127 (2013.01); B29C 45/14655 (2013.01); H01L 23/13 (2013.01); H01L 23/3121 (2013.01); H01L 23/32 (2013.01); H01L 23/42 (2013.01); H01L 23/433 (2013.01); H05K 1/181 (2013.01); B29C 45/34 (2013.01); H01L 21/565 (2013.01); H01L 25/16 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/19105 (2013.01);
Abstract

An air vent is formed in a substrate of an electronic device such that air in a cavity of a metal mold can be released through the air vent when a resin is molded. Solder resist is disposed on a second surface of the substrate and has an opening portion at a position corresponding to the air vent. As such, the air can be also released from a clearance between a lower mold and the solder resist resulting from a rough surface of the solder resist. The resin can be held in a space provided between the second surface of the substrate and the lower mold. Therefore, the resin having passed through the air vent can be restricted from flowing out, and the air vent can be restricted from losing its function due to the substrate and the metal mold closely contacting with each other.

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