The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 17, 2017
Filed:
Apr. 05, 2013
Applicant:
Panasonic Intellectual Property Management Co., Ltd., Osaka-shi, Osaka, JP;
Inventors:
Arata Kishi, Osaka, JP;
Hironori Munakata, Osaka, JP;
Koji Motomura, Osaka, JP;
Hiroki Maruo, Osaka, JP;
Assignee:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/18 (2006.01); H05K 3/34 (2006.01); H01L 29/00 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H05K 1/181 (2013.01); H01L 24/16 (2013.01); H01L 24/17 (2013.01); H01L 24/32 (2013.01); H01L 24/73 (2013.01); H01L 24/81 (2013.01); H01L 24/83 (2013.01); H01L 24/92 (2013.01); H05K 3/3436 (2013.01); H05K 3/3463 (2013.01); H01L 24/13 (2013.01); H01L 24/29 (2013.01); H01L 2224/10156 (2013.01); H01L 2224/16238 (2013.01); H01L 2224/293 (2013.01); H01L 2224/2929 (2013.01); H01L 2224/32052 (2013.01); H01L 2224/32057 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73203 (2013.01); H01L 2224/81052 (2013.01); H01L 2224/8159 (2013.01); H01L 2224/81191 (2013.01); H01L 2224/81609 (2013.01); H01L 2224/81611 (2013.01); H01L 2224/81613 (2013.01); H01L 2224/81639 (2013.01); H01L 2224/81647 (2013.01); H01L 2224/81815 (2013.01); H01L 2224/81935 (2013.01); H01L 2224/81951 (2013.01); H01L 2224/81986 (2013.01); H01L 2224/83104 (2013.01); H01L 2224/83192 (2013.01); H01L 2224/9211 (2013.01); H01L 2224/92125 (2013.01); H01L 2924/014 (2013.01); H01L 2924/0132 (2013.01); H01L 2924/0133 (2013.01); H01L 2924/01322 (2013.01); H01L 2924/384 (2013.01); H05K 3/3484 (2013.01); H05K 2201/10734 (2013.01); H05K 2201/10977 (2013.01); H05K 2201/10992 (2013.01); H05K 2201/2009 (2013.01); H05K 2201/2036 (2013.01); H05K 2201/2045 (2013.01); Y02P 70/613 (2015.11);
Abstract
A mounting structure includes a bonding material () that bonds second electrodes () of a circuit board () and bumps () of a semiconductor package (), the bonding material () being surrounded by a first reinforcing resin (). Moreover, a portion between the outer periphery of the semiconductor package () and the circuit board () is covered with a second reinforcing resin (). Even if the bonding material () is a solder material having a lower melting point than a conventional bonding material, high drop resistance is obtained.