The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 17, 2017

Filed:

May. 30, 2013
Applicant:

Kyocera Corporation, Fushimi-ku, Kyoto-shi, Kyoto, JP;

Inventors:

Yukio Fujihara, Kyoto, JP;

Kenjirou Fukuda, Kyoto, JP;

Assignee:

KYOCERA Corporation, Kyoto, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/00 (2006.01); H05K 1/11 (2006.01); H01L 33/62 (2010.01); H05K 1/18 (2006.01); H05K 7/12 (2006.01); H05K 1/02 (2006.01); H01L 33/48 (2010.01);
U.S. Cl.
CPC ...
H05K 1/111 (2013.01); H01L 33/62 (2013.01); H05K 1/181 (2013.01); H01L 33/486 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2924/15174 (2013.01); H01L 2924/181 (2013.01); H05K 1/02 (2013.01); H05K 1/112 (2013.01); H05K 1/117 (2013.01); H05K 2201/0367 (2013.01); H05K 2201/09036 (2013.01); H05K 2201/0939 (2013.01); Y02P 70/611 (2015.11);
Abstract

There is provided a wiring board capable of strengthening the bonding between an external terminal and a wiring of an external circuit board. A wiring board includes an insulating substrate having two main surfaces facing each other, side surfaces connecting to the two main surfaces and concave portions concave from the side surfaces and connecting to at least one of the two main surfaces; and external terminals disposed from one of the main surfaces to inner surfaces of the respective concave portions, each of the external terminals having a convex-shaped section disposed on one main surface side along each of the concave portions.


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