The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 17, 2017

Filed:

Nov. 25, 2014
Applicant:

Broadcom Corporation, Irvine, CA (US);

Inventors:

Alfred Grau Besoli, Barcelona, ES;

Nicolaos Georgiou Alexopoulos, Irvine, CA (US);

Jesus Alfonso Castaneda, Los Angeles, CA (US);

Chryssoula Angelakis Kyriazidou, Kifisia, GR;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H04M 1/00 (2006.01); H04B 7/0404 (2017.01); H04B 7/06 (2006.01); H04B 7/08 (2006.01); H01Q 1/00 (2006.01); H01Q 1/22 (2006.01); H01Q 3/26 (2006.01); H01Q 9/20 (2006.01); H01Q 21/06 (2006.01); H01Q 21/20 (2006.01); H01Q 21/28 (2006.01); H01Q 21/29 (2006.01); H01Q 25/00 (2006.01);
U.S. Cl.
CPC ...
H04B 7/0404 (2013.01); H01Q 1/007 (2013.01); H01Q 1/2291 (2013.01); H01Q 3/26 (2013.01); H01Q 9/20 (2013.01); H01Q 21/065 (2013.01); H01Q 21/205 (2013.01); H01Q 21/28 (2013.01); H01Q 21/293 (2013.01); H01Q 25/00 (2013.01); H04B 7/0617 (2013.01); H04B 7/086 (2013.01); H01L 2223/6677 (2013.01); H01L 2224/16227 (2013.01); H01L 2924/15192 (2013.01);
Abstract

Aspects of the subject disclosure may include, for example, an integrated circuit that includes at least one die having transceiver circuitry that generates outbound signals that convey outbound data and that receives inbound signals that convey inbound data. A first array of antenna elements arranged along the top portion of the IC package operate in conjunction with the transceiver circuitry to transmit at least a first portion of the outbound signals as first wireless transmissions and/or generate at least a first portion of the inbound signals from first wireless receptions. A second array of antenna elements arranged along the bottom portion of the IC package operate in conjunction with the transceiver circuitry to transmit at least a second portion of the outbound signals as second wireless transmissions and/or to generate at least a second portion of the inbound signals from second wireless receptions. Other embodiments are disclosed.


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