The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 17, 2017
Filed:
Dec. 17, 2013
Applicant:
Avago Technologies General Ip (Singapore) Pte. Ltd., Singapore, SG;
Inventors:
Steve Martin, Fort Collins, CO (US);
Osvaldo Buccafusca, Fort Collins, CO (US);
Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H03H 9/00 (2006.01); H03H 9/24 (2006.01); H03H 9/17 (2006.01); H03H 9/10 (2006.01); H01L 41/00 (2013.01);
U.S. Cl.
CPC ...
H03H 9/2405 (2013.01); H03H 9/1007 (2013.01); H03H 9/17 (2013.01); H03H 2009/241 (2013.01);
Abstract
An electronic package includes a die mounted on a first substrate; a second substrate disposed over the first substrate; a pillar wall extending between a surface of the die and an opposing surface of the second substrate to provide separation between the die and the second substrate, the pillar wall extending about a perimeter bounding the die and enclosing a cavity between the first and second substrates; and an encapsulating layer disposed over the first and second substrates and around the pillar wall. Substantially none of the encapsulating layer ingresses into the cavity.