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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9793826 B1

PDFFull Text
Date of Patent:
Oct. 17, 2017

Filed:

Jan. 22, 2016

Method of manufacturing a circuit device

Applicant:

Semiconductor Components Industries, Llc, Phoenix, AZ (US);

Inventors:

Shigeaki Mashimo, Maebashi, JP;

Fumio Horiuchi, Ashikaga, JP;

Kiyoaki Kudo, Gunma, JP;

Akira Sakurai, Tatebayashi, JP;

Yuhki Inagaki, Kumagaya, JP;

Assignee:

Semiconductor Components Industries, LLC, Phoenix, AZ (US);

Attorneys:

Polansky & Associates, P.L.L.C.

Paul J. Polansky

Primary Examiner:

Xiaoliang Chen

Int. Cl.
CPC ...
H05K 3/30 (2006.01); H02M 7/537 (2006.01); H01L 21/56 (2006.01); H01L 23/31 (2006.01); H01L 23/433 (2006.01); H01L 23/495 (2006.01); H01L 25/07 (2006.01); H01L 21/48 (2006.01); H01L 23/29 (2006.01); H01L 25/18 (2006.01); H01L 25/00 (2006.01); H05K 1/02 (2006.01); H05K 1/18 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H02M 7/537 (2013.01); H01L 21/4825 (2013.01); H01L 21/56 (2013.01); H01L 21/565 (2013.01); H01L 23/293 (2013.01); H01L 23/3121 (2013.01); H01L 23/4334 (2013.01); H01L 23/49531 (2013.01); H01L 23/49541 (2013.01); H01L 23/49575 (2013.01); H01L 24/85 (2013.01); H01L 25/072 (2013.01); H01L 25/18 (2013.01); H01L 25/50 (2013.01); H05K 1/0203 (2013.01); H05K 1/181 (2013.01); H01L 24/45 (2013.01); H01L 24/48 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/45015 (2013.01); H01L 2224/45124 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48106 (2013.01); H01L 2224/48137 (2013.01); H01L 2224/48139 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/48472 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/1203 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/13091 (2013.01); H01L 2924/14 (2013.01); H01L 2924/181 (2013.01); H01L 2924/19105 (2013.01); H01L 2924/19107 (2013.01); Y10T 29/4916 (2015.01);
Abstract

In one form, a method of manufacturing a circuit device comprises providing a lead frame comprising a plurality of leads, each comprising an island portion, a bonding portion elevated from the island portion, a slope portion extending obliquely so as to connect the island portion and the bonding portion, and a lead portion extending from the bonding portion. The circuit elements are mounted on upper surfaces of the island portions, and are connected to corresponding bonding portions by wirings. Two leads are adapted to be connected to positive and negative sides of a power source, and another lead is an output lead for providing alternating-current power. Lower surfaces of the island portions are attached to an upper surface of a circuit board. The circuit board, the circuit elements, and the lead frame are encapsulated by a resin, so that the lead portions are not covered by the resin.

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