The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9793466 B1

PDF
Full Text
Expired
Date of Patent:
Oct. 17, 2017

Filed:

Nov. 28, 2014
Applicant:

Miics & Partners Inc., Road Town, VG;

Inventor:

Juan Wang, Shenzhen, CN;

Assignee:

MiiCs & Partners Inc., Road Town, VG;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 41/107 (2006.01); H01L 41/047 (2006.01); H01L 41/113 (2006.01); H01L 41/29 (2013.01);
U.S. Cl.
CPC ...
H01L 41/1132 (2013.01); H01L 41/0478 (2013.01); H01L 41/29 (2013.01);
Abstract

An ultrasonic sensor includes a substrate. A first electrode and a first piezoelectric layer are stacked on one side of the substrate. A second electrode and a second piezoelectric layer are stacked on the other side of the substrate. A notch is defined in the first piezoelectric layer. And a conductive film is coated within the notch to couple the first electrode and the first piezoelectric layer.


Find Patent Forward Citations

Wang, Juan. (2017). Ultrasonic sensor and manufacturing method thereof (U.S. Patent No. 9793466). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9793466

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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