The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 17, 2017

Filed:

Mar. 27, 2014
Applicant:

Samsung Electro-mechanics Co., Ltd., Suwon-si, KR;

Inventors:

Yeon Ho Son, Suwon-si, KR;

Jae Kyung Kim, Suwon-si, KR;

Jun Kun Choi, Suwon-si, KR;

Assignee:

MPLUS CO., LTD., Suwon-si, Gyeonggi-Do, KR;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 41/09 (2006.01); H01L 41/047 (2006.01); H01L 41/083 (2006.01);
U.S. Cl.
CPC ...
H01L 41/0475 (2013.01); H01L 41/0906 (2013.01); H01L 41/083 (2013.01);
Abstract

Disclosed herein is a piezoelectric vibration module capable of improving adhesion between a piezoelectric element and an external electrode disposed on the piezoelectric element, the piezoelectric vibration module, including: a piezoelectric element printing patterns of a first internal electrode and a second internal electrode therein and having a first external electrode electrically connected to the first internal electrode and a second external electrode electrically connected to the second internal electrode on an external surface thereof, wherein the first external electrode and the second external electrode are made of silver (Ag) and are formed on the external surface of the piezoelectric element.


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