The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 17, 2017
Filed:
Sep. 26, 2012
Kaneka Corporation, Osaka-shi, Osaka, JP;
Tomokazu Tozawa, Settsu, JP;
Takahisa Iwahara, Settsu, JP;
Hiroshi Ogoshi, Settsu, JP;
Kazuhiko Hirabayashi, Settsu, JP;
Shuhei Ozaki, Settsu, JP;
Satoaki Iba, Settsu, JP;
Kazuaki Kanai, Settsu, JP;
Yasushi Kakehashi, Settsu, JP;
Takao Manabe, Settsu, JP;
Mitsuhiro Hori, Settsu, JP;
Ryoichi Narita, Settsu, JP;
KANEKA CORPORATION, Osaka, JP;
Abstract
A molded resin body for surface-mounted light-emitting device has a cured resin body integrally molded with a plurality of leads and a concave portion to which the plurality of leads are exposed at the bottom portion, in which the ten-point average roughness (Rz) of the opening surface of the concave portion is 1 μm to 10 μm, the glass transition temperature of the cured resin body is 10° C. or higher and the glass transition temperature is a value measured using a thermomechanical analyzer (TMA) under the conditions of a temperature range of −50 to 250° C., a temperature elevation rate of 5° C./min, and a sample size length of 1 to 5 mm, and the optical reflectance at 460 nm of the opening surface of the concave portion is 80% or more and the optical reflectance retention rate on the opening surface after heating the molded resin body at 180° C. for 72 hours is 90% or more.