The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 17, 2017

Filed:

Aug. 30, 2016
Applicant:

Texas Instruments Incorporated, Dallas, TX (US);

Inventors:

David William Hamann, Oconomowoc, WI (US);

Thomas E. Lillibridge, Plano, TX (US);

Abbas Ali, Plano, TX (US);

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/10 (2006.01); H01L 29/40 (2006.01); H01L 21/74 (2006.01); H01L 29/06 (2006.01);
U.S. Cl.
CPC ...
H01L 29/408 (2013.01); H01L 21/743 (2013.01); H01L 29/0623 (2013.01); H01L 29/401 (2013.01); H01L 29/407 (2013.01);
Abstract

A semiconductor device with a deep trench has a dielectric liner formed on sidewalls and a bottom of the deep trench. A pre-etch deposition step of a two-step process forms a protective polymer on an existing top surface of the semiconductor device, and on the dielectric liner proximate to a top surface of the substrate. The pre-etch deposition step does not remove a significant amount of the dielectric liner from the bottom of the deep trench. A main etch step of the two-step process removes the dielectric liner at the bottom of the deep trench while maintaining the protective polymer at the top of the deep trench. The protective polymer is subsequently removed.


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