The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 17, 2017
Filed:
Oct. 31, 2014
Applicant:
Silicon Laboratories Inc., Austin, TX (US);
Inventors:
Ka Y. Leung, Austin, TX (US);
Jean-Luc Nauleau, Los Gatos, CA (US);
Assignee:
SILICON LABORATORIES INC., Austin, TX (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/065 (2006.01); H01L 23/495 (2006.01); H01L 23/52 (2006.01); H01L 23/58 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 25/0655 (2013.01); H01L 23/4952 (2013.01); H01L 23/49575 (2013.01); H01L 23/52 (2013.01); H01L 23/585 (2013.01); H01L 24/73 (2013.01); H01L 24/97 (2013.01); H01L 24/48 (2013.01); H01L 24/49 (2013.01); H01L 2224/05554 (2013.01); H01L 2224/40 (2013.01); H01L 2224/48106 (2013.01); H01L 2224/48137 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/48257 (2013.01); H01L 2224/49171 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/01033 (2013.01); H01L 2924/01082 (2013.01); H01L 2924/10161 (2013.01); H01L 2924/14 (2013.01); H01L 2924/19041 (2013.01);
Abstract
An apparatus includes a wafer portion and a plurality of die fabricated in the wafer portion in a defined pattern such that the die are separated from each other by a dicing area or a street. The apparatus includes a conductive connection between given adjacent die. The conductive connection is electrically coupled to circuitry disposed on the given adjacent die.