The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 17, 2017
Filed:
Apr. 21, 2016
Peregrine Semiconductor Corporation, San Diego, CA (US);
Vikas Sharma, Reading, GB;
Peregrine Semiconductor San Diego, San Diego, CA (US);
Abstract
An integrated circuit (IC) structure for radio frequency (RF) circuits having a multi-point selectably grounded die seal and multi-point selectably grounded signal paths. Embodiments include switch-coupled grounding pads that can selectively electrically couple an internal grounding pad within the die seal of an IC die to a connection point on the die seal and/or on a signal path. When the IC die is embedded in a grounded system, the die seal and/or signal path can be locally grounded at selected connection points, and thus an IC die may be 'tuned' to mitigate the effects of parasitic coupling and/or to selective repurpose such parasitic coupling to generate a notch filter effect. Another aspect is selective grounding of inactive signal paths to improve isolation between signal ports.